Hot isostatic pressing assisted diffusion bonding for application to the Super Proton Synchrotron internal beam dump at CERN

The new generation internal beam dump of the Super Proton Synchrotron (SPS) at CERN will have to dissipate approximately 270 kW thermal power, deposited by primary proton beam. For this purpose, it is essential that cooling system features a very efficient heat evacuation. Diffusion bonding assisted Hot Isostatic Pressing (HIP) was identified as promising method joining circuits and materials dump's core in order maximise transfer efficiency. This paper presents investigation HIP diffusion between two CuCr1Zr blanks enclosing SS 316L tubes realisation real size prototype one plate, well assessments its performance under dumps most critical operational scenarios. Energy-dispersive X-ray (EDX) spectroscopy, microstructural analyses, measurements conductivity mechanical strength were performed characterize bonded interfaces (CuCr1Zr-CuCr1Zr CuCr1Zr-SS316L). A test bench allowed assess prototype. At interface, presence typical diffusional phenomena observed. Moreover, measured tensile least equivalent lowest ones assembled comparable bulk properties, meaning good quality achieved. Finally, successfully tested with an ad-hoc highest power expected SPS dump.